ACM Research, Inc. shipped its first plasma‑enhanced chemical vapor deposition silicon carbonitride (SiCN) system to a leading semiconductor manufacturer on April 27 2026. The Saturn Series system, built on a proprietary three‑station PECVD architecture, is the world’s first design to distribute the deposition process across three stations within a single reaction chamber, enabling tighter control and higher uniformity for 300‑millimeter wafers at temperatures up to 400 °C.
The new SiCN platform features four load ports and three process chambers, allowing high‑efficiency wafer handling and flexible operation. Its design supports copper oxidation reduction, copper diffusion barrier layers, and etch‑stop layers for logic and advanced packaging—key materials for next‑generation device integration.
ACM’s Q1 2026 preliminary results show revenue of $225–$230 million, a 31–33 % year‑over‑year increase, and shipments of $233–$238 million, up 49–52 % YoY. The company reaffirmed its full‑year 2026 revenue outlook of $1.08–$1.175 billion, reflecting a 20–30 % growth target. However, gross margin fell to 40.9 % in Q4 2025 from 49.6 % a year earlier, driven by product‑mix shifts and competitive pricing. Management expects margin improvement in the second half of 2026 as the new SiCN system gains traction.
Dr. David Wang, ACM’s president and CEO, said, “The shipment of our first PECVD SiCN system marks an important milestone as ACM continues to expand its process technology capabilities.” He added, “This platform features an innovative equipment design to support more advanced process requirements and deliver the control and consistency needed for increasingly complex semiconductor manufacturing and next‑generation device integration.”
The announcement came amid a broader sector rally; on April 17 2026 ACM’s stock surged 8.2 % as investors reassessed the capital‑expenditure outlook for chipmakers. While the stock move was driven by sector momentum, the new SiCN system underscores ACM’s strategic shift toward high‑margin BEOL and packaging tools.
ACM’s expansion into PECVD, ALD, and other wafer‑processing steps follows a April 2 rebranding of its product families into the “ACM Planetary Family.” The move, coupled with the Lingang facility in Shanghai’s Special Area, positions ACM to serve the growing demand for advanced materials in both domestic and global markets, strengthening its competitive stance against established Western suppliers.
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