Supermicro announced the launch of its industry‑first, highest‑density blade‑server platform powered by AMD’s EPYC 4005 series processors. The new MicroBlade platform is a 6‑U system that can accommodate up to 40 nodes in a single enclosure, enabling a maximum of 320 nodes in a standard 48‑U rack and delivering unprecedented compute density and energy efficiency for cloud, edge, and SaaS workloads.
Each node in the MicroBlade platform is equipped with a single EPYC 4005 processor, two DDR5 ECC UDIMM slots, dual‑port 25 GbE networking, and integrated 25 GbE switches with 100 GbE uplinks. Advanced management features—including TPM 2.0, IPMI 2.0, KVM‑over‑IP, and Redfish API support—provide remote power control and BIOS configuration for large‑scale deployments.
The EPYC 4005 processors that power the platform offer 6 to 16 Zen 5 cores, clock speeds up to 5.7 GHz, DDR5‑5600 memory support, and up to 28 PCIe Gen 5 lanes. The platform is optimized for a broad range of workloads, from cloud and edge computing to SaaS, storage gateways, specialized compute, e‑commerce, cybersecurity, virtualization, and Kubernetes orchestration.
Charles Liang, President and CEO of Supermicro, said, "Our flexible blade architecture enables customers to mix different node types with different CPUs within a single enclosure and can incorporate up to 320 server nodes in a standard 48U rack." He added, "Supermicro continues to lead the industry in delivering advanced, energy‑efficient platforms to market that maximize scalability, lower total cost of ownership, and protecting data center investments for the long term."
The launch coincides with Supermicro’s Q2 FY2026 financial results, which reported revenue of $12.7 billion—an increase of 153% year‑over‑year—and earnings per share of $0.69, beating consensus estimates from Goldman Sachs and FactSet. The strong performance is largely attributed to the ramp‑up of GB300 system production, which has driven higher sales volumes and improved operational leverage. The new MicroBlade platform positions AMD as a key supplier for hyperscalers seeking high‑density, energy‑efficient compute infrastructure, further expanding Supermicro’s market reach.
The MicroBlade platform’s industry‑first high‑density design and flexible architecture—allowing mixed CPU and node configurations—differentiate it from competing blade solutions. By packing more compute into a smaller footprint while maintaining robust management and networking capabilities, Supermicro reinforces its leadership in delivering scalable, cost‑effective, and energy‑efficient data‑center platforms.
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