ASML announced a breakthrough in its extreme‑ultraviolet (EUV) lithography light‑source technology that raises the power of its plasma source from 600 watts to 1,000 watts. The higher‑power source is achieved by doubling the number of tin droplets processed per second and by using two smaller laser beams to shape the plasma, a change that is expected to increase wafer throughput from 220 to about 330 wafers per hour and to lift chip yield by up to 50% by the end of the decade.
The upgrade is a key step in ASML’s strategy to maintain its monopoly on EUV equipment. The company’s sole position in the market is reinforced by the fact that the new light source will allow customers such as TSMC, Samsung and Intel to run advanced nodes more efficiently, reducing production costs and shortening time‑to‑market for AI‑centric chips. ASML’s management highlighted the practical readiness of the technology, noting that "It’s not a parlor trick or something like this, where we demonstrate for a very short time that it can work. It’s a system that can produce 1,000 watts under all the same requirements that you could see at a customer."
ASML’s executive team also outlined a clear path for further power increases, with Michael Purvis stating "We see a reasonably clear path toward 1,500 watts, and no fundamental reason why we couldn’t get to 2,000 watts." Teun van Gogh added that the company is focused on keeping EUV costs lower for its customers, while a professor at Colorado State University praised the achievement, calling the one‑kilowatt output "pretty amazing."
The breakthrough comes amid growing geopolitical pressure on the EUV supply chain. China is reportedly developing its own EUV prototype, and U.S. startups such as xLight are pursuing alternative approaches. ASML’s high‑NA EUV platform, exemplified by the EXE:5200B system, is already being deployed by Intel, Samsung and SK Hynix, with TSMC taking a more cautious stance. The new light source strengthens ASML’s competitive edge and supports its continued investment in research and development, even though specific R&D spend figures were not disclosed.
The announcement underscores ASML’s role as the critical enabler of next‑generation logic and memory chips. By improving yield and throughput, the company is positioned to meet the surging demand for AI and high‑performance computing chips, while also reinforcing its strategic advantage against emerging U.S. and Chinese rivals. The development is expected to translate into lower production costs for fabs and faster time‑to‑market for customers, further consolidating ASML’s leadership in the semiconductor equipment industry.
The content on EveryTicker is for informational purposes only and should not be construed as financial or investment advice. We are not financial advisors. Consult with a qualified professional before making any investment decisions. Any actions you take based on information from this site are solely at your own risk.