Broadcom has begun shipping its latest artificial‑intelligence chip to Japanese technology firm Fujitsu, marking the first time the company has supplied a new AI accelerator to a major partner outside its hyperscaler customer base.
The chip is built on Broadcom’s 3.5D eXtreme Dimension System in Package (XDSiP) platform, which stacks components to deliver higher performance and lower power consumption. Fujitsu is currently testing engineering samples and plans to move into production later in 2026.
This shipment follows Broadcom’s Q4 FY2025 results, in which the company reported $18.015 billion in revenue, up 28% year‑over‑year, and $6.5 billion in AI semiconductor revenue, a 74% increase. Management projects AI semiconductor revenue to double to $8.2 billion in Q1 FY2026, reflecting robust demand for custom AI accelerators and Ethernet AI switches.
The partnership expands Broadcom’s reach beyond hyperscalers. While the company has long collaborated with Fujitsu on high‑performance computing ASICs, this new AI chip represents a distinct phase of the relationship. Broadcom plans to sell at least one million of these chips by 2027, supported by a backlog exceeding $10 billion for AI switches alone.
"We see the momentum continuing in Q1 and expect AI semiconductor revenue to double year‑over‑year to $8.2 billion, driven by custom AI accelerators and Ethernet AI switches," said Hock Tan, President and CEO. "We're proud to deliver the first 3.5D custom compute SoC for Fujitsu – a testament to the outstanding execution and innovation by the Broadcom team," added Frank Ostojic, Senior Vice President and General Manager of the ASIC Products Division. Naoki Shinjo, SVP, Head of Advanced Technology Development Unit at Fujitsu, noted, "This breakthrough is a key enabler for Fujitsu's FUJITSU‑MONAKA initiative to deliver cutting‑edge, high‑performance, and low‑power processors. We highly value our strategic partnership with Broadcom and believe this technology will help power a more scalable and sustainable AI‑driven society."
Broadcom’s AI chip market is growing rapidly, with the company positioned as a key competitor to Nvidia and AMD. The new partnership signals confidence in the 3.5D XDSiP platform’s ability to meet data‑center demands for energy efficiency and performance. While the AI segment’s higher mix may compress margins, Broadcom’s strong backlog and projected revenue growth suggest the company is well‑placed to capitalize on the expanding AI infrastructure market.
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