Camtek Secures $31 Million Order from Leading OSAT for AI‑Focused CoWoS Packaging

CAMT
March 30, 2026

Camtek Ltd. (NASDAQ: CAMT) announced a new multi‑system order worth $31 million from a leading outsourced semiconductor assembly and test (OSAT) provider, focused on CoWoS‑style packaging that supports artificial‑intelligence workloads. The systems are scheduled for delivery within 2026, adding to the company’s growing pipeline of AI‑centric advanced‑packaging solutions.

The $31 million contract brings Camtek’s total orders from leading OSATs in the first quarter of 2026 to more than $90 million, with the bulk of the volume tied to AI‑related packaging. This concentration underscores the rapid expansion of AI infrastructure and the increasing role of OSATs in delivering high‑performance chip solutions.

The order reinforces Camtek’s position as a key supplier for advanced packaging in the AI market. Its Hawk and Eagle G5 inspection and metrology platforms, already gaining traction in high‑bandwidth memory and chiplet segments, are expected to benefit from the new contract. The additional capacity will support the company’s broader strategy to capture growth in high‑margin AI applications.

"We are very encouraged by the exceptional volume of orders from leading OSATs in the first quarter of 2026, which underscores our observation that OSATs are playing an increasingly central role in the advanced packaging market for AI applications," said CEO Rafi Amit. The comment highlights management’s confidence in a strong second half of 2026 and the company’s continued momentum in the AI‑driven packaging space.

Camtek’s Q4 2025 revenue of $128.1 million, with AI products accounting for roughly 50 % of sales, provides context for the new order’s impact. The company has guided for double‑digit revenue growth in 2026, with a focus on expanding its AI portfolio and improving gross margins, which were above 51 % in Q4 2025. The new contract is expected to contribute to that growth trajectory and support the company’s strategic emphasis on high‑performance AI infrastructure.

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