Flex announced a new phase in its partnership with AMD that will see the company begin manufacturing the AMD Instinct MI355X 8‑GPU platform at its headquarters in Austin, Texas. The MI355X platform bundles eight AMD Instinct GPUs on a single board, uses PCIe Gen 5 interfaces, high‑bandwidth memory, and a high‑speed interconnect fabric, and will be tested with Flex’s JetCool liquid‑cooling system, which the company says can improve thermal efficiency by up to 30%.
The move marks a significant expansion of U.S. manufacturing for AMD’s Instinct line, giving the company a domestic production base that reduces supply‑chain risk and supports the growing demand for AI accelerators in data‑center environments. For Flex, the partnership strengthens its full‑stack AI infrastructure offering—power, cooling, and IT integration—while reinforcing its strategy of regionalizing production to capture higher‑margin data‑center business. "By combining Flex's advanced manufacturing capabilities, resilient supply chain, and U.S. footprint with AMD's leadership in high‑performance computing, we're enabling customers to scale AI faster and with greater reliability," said Rob Campbell, President of Communications, Enterprise and Cloud at Flex.
Flex’s financial performance in the most recent quarter underscores the strategic fit of the partnership. In Q1 FY2026, the company reported net sales of $6.6 billion and an adjusted EPS of $0.72, beating estimates of $0.63 and $6.26 billion, respectively. The results were driven by strong demand from data‑center customers and a shift toward more profitable business segments. In Q4 FY2025, Flex posted net sales of $6.4 billion and an adjusted EPS of $0.73, while Q4 FY2024 saw net sales of $6.2 billion and an adjusted EPS of $0.57. The upward trend in sales and earnings reflects the company’s focus on high‑growth end‑markets such as data center and power, a point echoed by CEO Revathi Advaithi: "Our first quarter results are a great start to FY26 and a testament to the strength of our strategic focus on high‑growth end‑markets like data center and power."
The MI355X platform itself is built on AMD’s 4th‑generation CDNA architecture, manufactured on a 3 nm process, and features 288 GB of HBM3E memory per GPU with 8 TB/s of bandwidth. It supports advanced precision formats such as FP6 and FP4, positioning it to compete directly with NVIDIA’s Blackwell series. Flex’s acquisition of JetCool Technologies in November 2024 has enabled the company to integrate liquid‑cooling directly into its server designs, a capability that is now being leveraged in the MI355X production line.
Keivan Keshvari, Senior Vice President of Global Operations & Quality at AMD, noted that expanding U.S. manufacturing with Flex "represents a step in strengthening the company's delivery capabilities for customers." The partnership not only enhances AMD’s domestic supply chain but also signals a broader industry shift toward localized production of AI hardware, a trend driven by geopolitical considerations and the need for rapid deployment of high‑density compute solutions.
Overall, the collaboration positions both Flex and AMD to better serve the accelerating demand for AI infrastructure, strengthens their competitive stance against NVIDIA, and aligns with Flex’s strategy of building higher‑margin, end‑to‑end data‑center solutions. The announcement is a material development that will likely influence long‑term investment models for stakeholders focused on AI and data‑center growth.
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