JetCool, a subsidiary of Flex Ltd., has partnered with Broadcom to provide liquid‑cooling solutions for next‑generation AI XPUs. The collaboration combines JetCool’s direct‑to‑chip cooling technology with Broadcom’s AI silicon architecture, enabling sustained multi‑kilowatt ASIC operation at heat flux levels of 4 W/mm² per device.
JetCool’s patented micro‑convective cooling system delivers fluid jets directly onto chip hotspots, reducing thermal resistance and improving efficiency compared with conventional air cooling. By integrating cold plates, manifolds, and coolant distribution units into Broadcom’s mechanical and thermal reference architecture, the two companies can deliver a production‑ready thermal foundation for hyperscale AI data centers.
For Flex, the deal strengthens its “grid‑to‑chip” positioning by adding a high‑margin cooling capability that can be manufactured at scale. The partnership also expands Flex’s reach into Broadcom’s extensive customer base, creating new revenue opportunities in the AI infrastructure market. For Broadcom, the collaboration ensures that its next‑generation AI XPUs will have robust thermal management, a critical requirement for sustained high performance in data‑center deployments.
Ken Kutzler, VP of AI Systems Development for Broadcom’s ASIC Products Division, said, “Supporting multi‑kilowatt ASIC platforms requires a tight coordination across silicon architecture, advanced packaging, power delivery, and thermal engineering. Our partnership with JetCool, combined with Flex’s manufacturing and integration capabilities, provides a clear path from advanced ASIC innovation to high‑volume AI XPU deployment.”
Bernie Malouin, PhD, VP of Liquid Cooling at Flex, added, “Cooling has become a primary design constraint for next‑generation AI silicon.” He further noted, “JetCool’s advanced direct‑to‑chip cold plate technology, combined with Flex’s global manufacturing scale, enables production‑ready thermal solutions engineered for high‑density silicon architectures. We’ve developed a strong partnership with the Broadcom team, and together we’re advancing scalable thermal solutions for the next generation of AI infrastructure.”
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