GlobalFoundries today introduced its AutoPro150 eMRAM technology on the company’s ultra‑low‑power FDX platform. The new memory offers an endurance of up to 500 000 cycles, a sub‑10 nanosecond read speed, and reliable operation at temperatures up to 150 °C, making it well suited for safety‑critical automotive functions such as advanced driver‑assist systems (ADAS) and software‑defined vehicle microcontrollers.
The AutoPro150 eMRAM will be manufactured in both Germany and the United States, with volume production slated to begin in the second half of 2026 at the Dresden facility. This timing aligns with GlobalFoundries’ Project SPRINT expansion, which aims to increase Dresden’s capacity to more than one million wafers per year by 2028, positioning the plant as Europe’s largest semiconductor manufacturing site.
The automotive semiconductor market is projected to grow at a 4.99 % CAGR from 2025 to 2035, with ADAS alone expected to reach roughly $30 billion by 2025. GlobalFoundries already accounts for about 25 % of its wafer revenue from automotive, and the company estimates automotive revenue near $1.5 billion in 2025. The AutoPro150 launch supports the firm’s goal of making automotive a multibillion‑dollar business by 2030.
GlobalFoundries differentiates itself in a market dominated by TSMC (≈71 % of global foundry revenue) and Samsung (≈8 %). By focusing on specialized technologies such as eMRAM and the energy‑efficient FDX platform, the company offers automotive customers a unique combination of performance, power efficiency, and reliability that is difficult to replicate with mainstream process nodes.
Ed Kaste, senior vice president of GlobalFoundries’ ultra‑low‑power CMOS business, said, “With the introduction of our Auto Grade 1 ready FDX+AutoPro150 eMRAM platform, GF is raising the bar for embedded memory performance in the most demanding automotive and industrial environments. By combining fast, reliable MRAM with our energy‑efficient FDX platform, we’re giving customers a powerful path to build the next‑generation of SDVs and emerging Physical AI systems.”
Dr. Dominik Erb, vice president of digital semiconductor roadmaps & operations at Bosch, added, “MRAM is a technology at the edge of automotive innovation, providing speed, endurance and reliability that will help next‑generation MCUs for software‑defined vehicles with real‑time, distributed intelligence. We welcome that GlobalFoundries delivers embedded MRAM technology on their FDX platform and creates a new solution that helps scale with the growing demand across the automotive industry.”
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