Kopin Corporation and Fabric.AI announced a partnership to develop a MicroLED‑based optical interconnect that will replace copper wiring between GPUs and processors in high‑performance AI data centers. The collaboration leverages Kopin’s proprietary MicroLED and NeuralDisplay™ architecture and will make Kopin the exclusive manufacturer of the Neural I/O™ chipsets, with Fabric.AI providing system‑level design and integration.
Fabric.AI has placed a $15 million purchase order to fund the demonstration chipset, and Kopin owns 19.9 % of Fabric.AI. The partnership positions Kopin to tap into the rapidly expanding AI infrastructure market, where energy efficiency and bandwidth are critical constraints for data‑center operators.
Kopin’s recent financials provide context for the partnership. In Q4 2025, the company reported revenue of $8.4 million, a 42 % decline year‑over‑year, and a net loss of $5.02 million, an improvement from the prior year’s operating loss. The company also raised $56 million in a private placement and reported an EPS of $0.04, beating analyst expectations of –$0.01.
The optical interconnect market is projected to grow from $8.6 billion in 2025 to $38.4 billion by 2034, a CAGR of 18.1 %. Fabric.AI has raised $21.5 million in financing to support its new technology, and the partnership could position Kopin to capture a share of this high‑growth segment by providing a photon‑based solution that eliminates copper wiring and laser‑based systems.
"The marriage of our MicroLED technology with our bi‑directional NeuralDisplay™ architecture is exactly what the industry needs to break through current interconnect bottlenecks," said Kopin CEO Michael Murray. "MicroLED technology represents a powerful new frontier beyond displays. Our collaboration with Fabric.AI extends the reach of our technology into AI infrastructure, enabling a new class of interconnect solutions designed for scale, efficiency, and performance." Josh Silverman, CEO of Fabric.AI, added, "Kopin's bi‑directional MicroLED technology is the foundation of our optical interconnect architecture. MicroLED‑based interconnects are the leading edge in infrastructure for AI data centers."
The partnership gives Kopin a strategic foothold in a market that demands higher data rates and lower power consumption. By manufacturing the Neural I/O™ chipsets, Kopin can capture a high‑margin revenue stream while leveraging its existing MicroLED expertise. The collaboration also aligns with the broader industry shift toward photon‑based interconnects, positioning both companies to benefit from the projected growth in AI data‑center infrastructure.
The partnership signals Kopin’s intent to diversify beyond its traditional display business and capitalize on the expanding AI market. With a proven MicroLED platform and a dedicated partner in Fabric.AI, Kopin is poised to deliver a scalable, efficient interconnect solution that could reshape data‑center communication and open new revenue opportunities.
The content on EveryTicker is for informational purposes only and should not be construed as financial or investment advice. We are not financial advisors. Consult with a qualified professional before making any investment decisions. Any actions you take based on information from this site are solely at your own risk.