Microchip Technology today introduced its BZPACK mSiC power modules, a new family of silicon‑carbide devices engineered to meet the rigorous High Humidity High Voltage High Temperature Reverse Bias (HV‑H3TRB) standard. The modules support a wide range of topologies—including half‑bridge, full‑bridge, three‑phase, and PIM/CIB configurations—giving designers flexibility to optimize performance, cost, and system architecture for demanding power‑conversion applications.
Each module features a 600 V case, stable on‑demand resistance across temperature ranges, and substrate options in aluminum oxide or aluminum nitride. The devices are tested to exceed the 1,000‑hour HV‑H3TRB standard, ensuring superior insulation, thermal management, and long‑term durability in harsh environments such as industrial automation, renewable‑energy inverters, and automotive power‑train systems.
Microchip’s SiC portfolio has grown over 20 years, and the BZPACK launch is part of a broader strategy to capture the expanding silicon‑carbide market. The company’s Q3 FY2026 earnings—net sales of $1.186 billion, up 15.6 % year‑over‑year, and diluted EPS of $0.06 GAAP ($0.44 Non‑GAAP)—demonstrate the financial strength that underpins continued investment in high‑performance power solutions.
Vice‑president of Microchip’s high‑power solutions business, Clayton Pillion, said, “The launch of our BZPACK mSiC power modules reinforces Microchip’s commitment to delivering rugged high‑performance solutions for the most demanding power‑conversion environments. By leveraging our advanced mSiC technology, we’re giving customers a simpler path to building efficient, long‑lasting systems across industrial and sustainability markets.”
The modules are now available in production quantities and can be purchased directly from Microchip or through its sales representatives. The launch underscores the company’s commitment to expanding its SiC offerings and targeting sectors that require robust, efficient power devices for harsh operating conditions.
By adding a new, high‑reliability product line at a time when Microchip’s recent earnings show strong growth, the BZPACK launch positions the company to capture a larger share of the industrial, automotive, and renewable‑energy markets while reinforcing its reputation for rugged, high‑performance power solutions.
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