Microchip Technology introduced the MCPF1525 Power Module on February 3 2026, a 16‑volt input buck converter that delivers 25 amps per module and can be stacked to 200 amps. The design features a programmable PMBus and I²C controls, diagnostic functions for over‑temperature, over‑current and over‑voltage protection, and a thermally enhanced package that operates from –40 °C to +125 °C. The vertical construction reduces board area by up to 40 % compared with competing solutions, enabling higher power density in the same rack space.
The module is engineered to power PCIe® Switchtec™ switches and high‑performance compute MPU applications, directly supporting AI deployments by improving power efficiency and reliability in data‑center environments. By delivering higher current in a compact form factor, the MCPF1525 allows customers to reduce rack space, lower cooling requirements, and increase overall system throughput without expanding the physical footprint.
Microchip’s management highlighted the module’s role within its broader AI data‑center ecosystem. “By leveraging Microchip’s comprehensive solutions—including PCIe® Switchtec™ technology, FPGAs, MPUs and Flashtec® NVMe® controllers—the MCPF1525 power module can help customers achieve the system efficiency, reliability and scalability required for high‑performance data‑center and industrial computing applications,” said Rudy Jaramillo, vice president of Microchip’s analog power and interface division. The announcement underscores the company’s strategy to offer an integrated stack of compute, connectivity, storage and power solutions for AI workloads.
The launch positions Microchip to compete more effectively in the AI infrastructure market, where demand for high‑density, high‑efficiency power is accelerating. The MCPF1525’s ability to deliver up to 200 amps when stacked, combined with its reduced board area, gives customers a tangible advantage in scaling AI and HPC systems while managing power and thermal budgets.
The product launch is a key milestone in Microchip’s AI data‑center strategy, reinforcing its commitment to delivering end‑to‑end solutions that address the growing needs of AI and high‑performance computing customers. The MCPF1525 is expected to drive future revenue growth in the AI data‑center segment and strengthen Microchip’s competitive position in a rapidly expanding market.
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