SK Hynix announced that it has begun mass production of its 192‑GB SOCAMM2 memory modules on April 19 2026. The modules are built on a 1‑nanometer (sixth‑generation 10‑nanometer) process and are the first LPDDR5X‑based memory standard to be deployed at this scale for AI servers.
The company claims that SOCAMM2 delivers more than double the bandwidth and over 75 % better power efficiency than conventional RDIMM memory. These gains address the memory bottleneck that limits the training and inference of large language models, allowing AI workloads to move data faster while consuming less power and generating less heat.
SOCAMM2 is engineered specifically for NVIDIA’s Vera Rubin platform, the firm’s next‑generation AI‑factory architecture that integrates GPUs, networking, and software. By providing high‑capacity, high‑bandwidth memory, SK Hynix helps NVIDIA meet the memory demands of its projected $1 trillion revenue pipeline from Blackwell and Rubin chips, reinforcing NVIDIA’s full‑stack AI infrastructure and giving it a competitive edge in data‑center solutions.
The launch of SOCAMM2 places SK Hynix in direct competition with other memory leaders such as Micron and Samsung, both of whom have shipped SOCAMM2 samples. The new standard bridges the gap between ultra‑high‑bandwidth HBM and traditional DDR5 RDIMM, offering a balance of performance, power efficiency, and serviceability that is critical for large‑scale AI deployments.
"By supplying the 192 GB SOCAMM2, SK hynix has established a new standard for AI memory performance," said Justin Kim, President & Head of AI Infra at SK Hynix. The statement underscores the company’s intent to become the trusted partner for AI memory solutions as demand for high‑capacity, power‑efficient memory continues to rise.
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