Onto Innovation announced the launch of its Dragonfly G5 inspection and metrology platform on March 16, 2026. The new system builds on Onto’s 3Di coherent‑light technology, delivering sub‑micron defect detection and faster scan times that are tailored for advanced packaging and AI chiplet integration markets.
The Dragonfly G5 offers a resolution of 150 nm and incorporates AI‑driven algorithms to accelerate scan times, enabling precise defect detection in 2.5D and 3D packaging, including high‑bandwidth memory (HBM) and AI chiplet applications. Compared with earlier models, the platform’s faster scan speeds reduce inspection cycle times and improve throughput for high‑volume manufacturing.
The launch addresses a growing demand for precise inspection in the AI semiconductor supply chain. A leading HBM manufacturer has already selected the Dragonfly G5, placing double‑digit order commitments that will ship beginning in Q2 2026. The platform’s capabilities are projected to serve a serviceable available market of more than $500 million, underscoring its commercial potential.
Onto’s Q4 2025 advanced‑packaging revenue reached $145 million, with the 2.5D packaging segment doubling sequentially. The company secured a $240 million volume purchase agreement with an HBM customer that extends through 2027, providing substantial revenue visibility. The Dragonfly G5 launch supports Onto’s strategy to become a key enabler for AI chip manufacturing and strengthens its competitive moat in the advanced‑packaging market.
CEO Mike Plisinski said, “We are proud to announce this new inspection solution which is exceeding expectations in performance and value to our customers.” He added, “The significantly enhanced base platform enables a suite of powerful new capabilities designed specifically to address emerging process‑control challenges in 3D and 2.5D packaging applications, resulting in precise defect detection while reducing nuisance defects at a compelling cost of ownership.”
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