QuickLogic Corporation announced the launch of its RadPro FPGA development kit, the company’s first radiation‑hardened device fabricated in the United States on GlobalFoundries’ 12 nm process. The kit will be demonstrated at Booth 15 of the 41st Hardened Electronics and Radiation Technology (HEART) Conference, scheduled for April 13–17, 2026 in Shreveport, Louisiana.
The development kit is available for order immediately, with shipments planned after the conference, and is supported by QuickLogic’s Aurora industry‑standard FPGA tools. This milestone aligns with the company’s strategic focus on radiation‑hardened and embedded FPGA IP, positioning QuickLogic as a potential sole source for U.S. defense customers while expanding commercial storefront opportunities.
CEO Brian Faith highlighted the launch as a key step in QuickLogic’s radiation‑hardened FPGA roadmap, noting that initial orders were accepted during Q1 and that the company expects to fulfill them following the HEART Conference. He added that the RadPro FPGA, now operational in hardware and supported by Aurora tools, will enable defense‑in‑the‑box evaluations that can transition into long‑term defense and aerospace programs of record.
The HEART Conference, a specialized event focused on radiation effects on electronics, provides a platform for QuickLogic to showcase its technology to defense stakeholders and to demonstrate the advantages of U.S. fabrication for secure, radiation‑hardened components.
The RadPro FPGA’s U.S. fabrication on GlobalFoundries’ 12 nm process underscores QuickLogic’s commitment to domestic manufacturing and aligns with defense industry priorities for secure, radiation‑hardened components.
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