SCHMID Group unveiled its Any Layer ET process, a full‑panel‑level embedded‑traces technology that embeds copper precisely within dielectric layers of IC substrates, panel‑level packaging, and glass‑core substrates. The platform combines deep reactive ion etching, physical vapor deposition, electrochemical deposition, and chemical‑mechanical polishing to deliver superior line definition, electrical performance, and yield across large‑format panels.
The Any Layer ET flow builds on SCHMID’s InfinityLine product portfolio, allowing customers to industrialize next‑generation substrate manufacturing without changing existing capital equipment. By offering a single‑panel handling concept and touchless transport architecture, the platform reduces defectivity, stabilizes process control, and delivers best‑in‑class yield performance for high‑volume production.
The advanced packaging market is projected to reach USD 87.01 billion by 2035, growing at a CAGR of 7.59%. SCHMID’s new process directly addresses the demand for compact, energy‑efficient devices that power AI, high‑performance computing, and 5G. The company’s focus on licensing technology and supplying equipment positions it as a key enabler for the broader semiconductor ecosystem, while the Any Layer ET process expands its footprint in the high‑growth glass‑core packaging segment.
SCHMID will showcase the technology at the ECTC 2026 conference in Orlando, Florida, on May 26‑29. Chief Sales Officer Roland Rettenmeier will present a session titled “InfinityBoard – A Panel‑Level Glass‑Core Packaging Platform for Ultra‑Fine RDL and Vertical Interconnect Integration,” highlighting how the Any Layer ET process supports AI‑driven compute architectures and future glass‑core packaging.
"The future of advanced packaging will be defined by precision, reliability, and scalable manufacturing. With Any Layer ET Process and Equipment, SCHMID (SHMD) provides customers with both the process know‑how and the critical production equipment required to industrialize next‑generation substrate manufacturing for AI‑driven compute architectures and future glass core packaging," said Roland Rettenmeier.
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