STMicroelectronics has entered high‑volume production of its PIC100 silicon photonics platform, a 300‑mm‑fab‑based line of 800 Gb/s and 1.6 Tb/s transceivers aimed at hyperscale data‑center and AI cluster customers. The announcement follows the February 2025 unveiling of the technology and the ramp‑up expected in the second half of 2025.
The PIC100 platform is positioned in a $15.5 billion market projected to grow at 17% CAGR through 2030. STMicroelectronics highlighted its silicon‑and‑silicon‑nitride waveguide losses and advanced modulator performance as key differentiators that enable higher bandwidth and lower power consumption compared with competitors.
Fabio Gualandris, President of Quality, Manufacturing and Technology, said: "Following the announcement of its new silicon photonics technology in February 2025, ST is now entering high‑volume production for leading hyperscalers. The combination of our technology platform and the superior scale of our 300 mm manufacturing lines gives us a unique competitive advantage to support the AI infrastructure super‑cycle."
Remi El‑Ouazzane, President, Microcontrollers, Digital ICs and RF products Group, commented: "AI demand is accelerating the adoption of high‑speed communication technology within the datacenter ecosystem. This is the right time for ST to introduce new power efficient silicon photonics technology and complementing it with a new generation of BiCMOS for our customers to design the next wave of optical interconnect products, which will enable 800Gbps/1.6Tbps solutions for the hyperscalers."
The company plans to quadruple production capacity by 2027, backed by long‑term capacity reservations from leading hyperscalers. This expansion is expected to accelerate revenue capture in a high‑margin silicon photonics segment that has become a critical component of AI infrastructure.
The move builds on STMicroelectronics’ broader strategy of focusing on high‑growth, high‑margin semiconductor segments. While the company’s overall revenue in Q1 2024 was $3.47 billion, the silicon photonics business is still in early stages, and the new production capability is expected to add a new revenue stream that offsets potential declines in legacy product lines.
The announcement also signals a shift toward integrated silicon photonics, with the company developing the PIC100 TSV platform that incorporates through‑silicon via technology to enhance optical connectivity density. This positions STMicroelectronics against major competitors such as Intel, Cisco, Broadcom, and Lumentum.
The high‑volume production launch is a significant operational milestone that could strengthen STMicroelectronics’ competitive position in the rapidly expanding AI infrastructure market and support its long‑term growth trajectory.
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