MCNEX and Valens Semiconductor have introduced a new line of high‑resolution front‑ and rear‑view automotive cameras that use Valens’ VA7000 A‑PHY chipsets. The cameras deliver 2560×1440 (QHD) video over unshielded twisted pair (UTP) or low‑cost coaxial cabling—a first for automotive‑grade cameras—and include a 4K rear‑view model that operates over shielded cabling.
The VA7000 chipsets enable multi‑gigabit data transmission with superior electromagnetic compatibility, allowing OEMs to reduce wiring harness cost and complexity while maintaining high image quality for advanced driver‑assist and autonomous systems. The technology supports connectivity over UTP wiring at 4 Gbps for 10 meters, a key advantage for cost‑sensitive, high‑volume automotive production.
This launch expands Valens’ presence in the automotive market and demonstrates the commercial viability of its A‑PHY technology in a high‑volume application. It positions Valens to capture a growing share of the automotive camera market, where demand for high‑resolution, low‑cable‑count solutions is accelerating. The announcement builds on Valens’ recent design wins that have driven positive market sentiment among investors and OEMs.
The first vehicle production using these cameras is expected in early 2027, marking a significant milestone for both companies’ high‑speed connectivity strategy and signaling the transition from development to mass production.
Young Hyun Jeong, VP of Automotive BU at MCNEX, said the partnership gives OEMs strong options for front‑ and rear‑facing cameras, highlighting the synergy between MCNEX’s camera expertise and Valens’ A‑PHY technology.
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