Menu

BeyondSPX has rebranded as EveryTicker. We now operate at everyticker.com, reflecting our coverage across nearly all U.S. tickers. BeyondSPX has rebranded as EveryTicker.

Price Performance Heatmap

5Y Price (Market Cap Weighted)

All Stocks (30)

Company Market Cap Price
TSM Taiwan Semiconductor Manufacturing Company Limited
TSMC engages in co-packaged optics & photonics packaging to improve data-center power and bandwidth.
$1.97T
$379.53
-0.09%
AMAT Applied Materials, Inc.
Co-packaged optics & photonics packaging is cited as part of AMAT's advanced packaging and data-center interconnect capabilities.
$313.72B
$386.90
-2.21%
KLAC KLA Corporation
Co-packaged Optics & Photonics Packaging is part of KLA's advanced packaging capabilities.
$235.97B
$1751.60
-2.47%
MRVL Marvell Technology, Inc.
Co-packaged optics & photonics packaging platforms enabling optical integration with AI accelerators.
$113.50B
$133.72
-0.08%
LITE Lumentum Holdings Inc.
Develops co-packaged optics and photonics packaging, enabling integrated optical-electronic interconnects for data centers.
$59.70B
$850.45
-0.27%
COHR Coherent, Inc.
Co-packaged Optics & Photonics Packaging for optical engine dies integrated with electronics.
$49.26B
$321.56
+2.60%
CLS Celestica Inc.
Co-packaged optics & photonics packaging capabilities are aligned with Celestica’s advanced integration and data-center throughput goals.
$44.21B
$384.32
-0.01%
JBL Jabil Inc.
Co-packaged optics & photonics packaging is a targeted capability for high-bandwidth data-center interconnects that Jabil is developing.
$32.31B
$305.14
-0.27%
GFS GLOBALFOUNDRIES Inc.
GF participates in co-packaged optics and photonics packaging, aligning silicon photonics with data-center bandwidth/power improvements.
$26.90B
$48.63
+0.45%
FN Fabrinet
FN provides Co-packaged Optics & Photonics Packaging, integrating optical and electronic dies to improve data-center power and bandwidth.
$24.42B
$683.66
+0.29%
UMC United Microelectronics Corporation
UMC is developing Co-packaged Optics & Photonics Packaging to improve data-center power and bandwidth efficiency.
$24.08B
$9.85
+2.66%
TSEM Tower Semiconductor Ltd.
Co-packaged optics & photonics packaging aligns with Tower's photonics and on-chip laser platforms to boost bandwidth and efficiency.
$24.01B
$216.81
+1.26%
ASX ASE Technology Holding Co., Ltd.
Co-packaged Optics & Photonics Packaging aligns with ASX's silicon photonics and FOCoS-Bridge innovations.
$23.34B
$27.52
+2.44%
MTSI MACOM Technology Solutions Holdings, Inc.
Co-packaged optics & photonics packaging aligns with integrating optical engines and electronics to boost data-center bandwidth.
$19.78B
$261.42
-0.95%
MKSI MKS Inc.
Co-packaged Optics & Photonics Packaging: Packaging solutions integrating optics/photonic and electronic dies.
$18.41B
$271.11
-1.11%
AMKR Amkor Technology, Inc.
Co-packaged Optics & Photonics Packaging is part of Amkor's advanced packaging capabilities for data-center and networking applications.
$15.16B
$60.54
-1.27%
ONTO Onto Innovation Inc.
EchoScan and related capabilities support co-packaged optics and photonics packaging workflows, a focused packaging-related theme.
$12.82B
$256.99
-1.76%
PLXS Plexus Corp.
Co-packaged Optics & Photonics Packaging is highlighted as a packaging capability, aligning with Plexus's advanced packaging ecosystem.
$6.10B
$225.19
-1.21%
KLIC Kulicke and Soffa Industries, Inc.
Co-packaged Optics & Photonics Packaging is part of KLIC's advanced packaging capabilities for data-center and AI-focused applications.
$4.18B
$79.61
-0.36%
ACMR ACM Research, Inc.
ACMR develops Co-packaged Optics & Photonics Packaging solutions for integrating electronic and optical dies, a distinct packaging-focused category.
$3.29B
$49.89
-1.69%
BHE Benchmark Electronics, Inc.
Provides Co-packaged Optics & Photonics Packaging solutions as part of complex electronics assembly.
$2.28B
$63.93
+0.17%
HIMX Himax Technologies, Inc.
Co-packaged Optics & Photonics Packaging represents WLO/CPO packaging and the related optical interconnect opportunity.
$1.75B
$9.84
-1.45%
LWLG Lightwave Logic, Inc.
LWLG collaborates with manufacturers to enable packaging and co-packaged optics/photonics integration via BEOL/PDK approaches.
$1.63B
$11.99
-1.88%
SKYT SkyWater Technology, Inc.
Co-packaged optics & photonics packaging capability aligns with advanced packaging and high-bandwidth needs.
$1.52B
$32.62
+3.90%
AEVA Aeva Technologies, Inc.
Co-packaged Optics & Photonics Packaging: packaging approach integrating optics with electronics in photonics modules.
$848.33M
$14.77
+4.60%
POET POET Technologies Inc.
POET emphasizes co-packaged optics/photonics packaging of optical engines with electronic dies, a core packaging offering.
$489.42M
$6.00
+4.62%
ALMU Aeluma, Inc.
Co-packaged optics & photonics packaging for integrated photonic-electronic systems.
$254.65M
$16.09
+12.87%
CPSH CPS Technologies Corporation
Co-packaged Optics & Photonics Packaging; advanced packaging approaches for high-bandwidth data applications.
$90.08M
$5.10
+1.80%
LEDS SemiLEDs Corporation
Co-packaged optics/photonics packaging relevant to integrated LED/optical systems.
$10.04M
$1.33
+9.02%
SMTK SmartKem, Inc.
Collaborations around co-packaged optics & photonics packaging for AI chip packaging reflect a packaging-focused investable theme.
$1.22M
$0.27

Loading company comparison...

Loading research report...

COHR Coherent, Inc.

Coherent Expands Silicon‑Carbide Epitaxy to 10 kV Power Devices, Boosting AI and Industrial Power Applications

Apr 10, 2026
TSM Taiwan Semiconductor Manufacturing Company Limited

TSMC Reports 35% Revenue Surge in Q1 2026, Gross Margin Up 1.1 Percentage Points

Apr 10, 2026
TSM Taiwan Semiconductor Manufacturing Company Limited

TSMC to Launch 3‑Nanometre Production at Second Japanese Facility in 2028

Apr 01, 2026
TSEM Tower Semiconductor Ltd.

GlobalFoundries Files Patent‑Infringement Lawsuits Against Tower Semiconductor

Mar 27, 2026
LITE Lumentum Holdings Inc.

Lumentum Expands U.S. Production with New Greensboro Facility to Meet AI Laser Demand

Mar 26, 2026
TSEM Tower Semiconductor Ltd.

Tower Semiconductor Completes Full Ownership of Japan’s 300‑mm Fab 7 and Announces Four‑Fold Capacity Expansion

Mar 25, 2026
COHR Coherent, Inc.

Coherent and Tower Semiconductor Demonstrate 400 Gbps Silicon‑Modulator Data Transmission, Advancing 3.2 T Optical Transceivers

Mar 23, 2026
TSEM Tower Semiconductor Ltd.

Tower Semiconductor Demonstrates 400 Gbps‑Per‑Lane Silicon Photonics Transmission

Mar 23, 2026
COHR Coherent, Inc.

Coherent Expands InP Portfolio Ahead of OFC 2026 Conference

Mar 18, 2026
JBL Jabil Inc.

Jabil Inc. Reports Fiscal Q2 2026 Earnings, Beats Estimates with Strong Revenue Growth

Mar 18, 2026
FN Fabrinet

Fabrinet Expands Capacity with Dedicated iPronics Silicon‑Photonics OCS Manufacturing Line

Mar 17, 2026
POET POET Technologies Inc.

POET Technologies and Lessengers Announce Joint Development of 1.6‑Terabit 2×DR4 Optical Transceiver for AI Data Centers

Mar 17, 2026
TSEM Tower Semiconductor Ltd.

Tower Semiconductor Launches Gen3 LDMOS Power‑Management Platform

Mar 17, 2026
LITE Lumentum Holdings Inc.

Marvell and Lumentum Demonstrate Interoperable Optical Circuit Switching at OFC 2026

Mar 16, 2026
POET POET Technologies Inc.

POET Technologies and LITEON Announce Strategic Collaboration to Co‑Develop Next‑Gen Optical Modules

Mar 16, 2026
TSEM Tower Semiconductor Ltd.

Tower Semiconductor Announces Strategic Partnership with Oriole Networks to Deliver Ultra‑Low‑Latency AI Networking

Mar 16, 2026